Live at MWC Barcelona 2026
Hall 5, Booth 5K26 | March 2–5
Wireless is the Nervous System for the AI Era
For years, wireless growth was driven by acquiring more spectrum. That era is ending. As AI-native orchestration and distributed systems scale, performance increasingly depends on how efficiently each transmitter uses the bandwidth it already has.
At MWC Barcelona, Eridan will demonstrate how Ultra-Clean Signal™ architecture improves spectral efficiency at its physical source.
What we’re showing at MWC
- Transmitter-level spectral efficiency improvements
- Support for higher-order modulation, including 1024 QAM as defined by 3GPP
- Distributed MIMO coordination across separated radios
- Interoperability across O-RAN 7.2x interfaces
- Transmitter architecture designed to reduce wasted power while maintaining signal linearity
Why spectral efficiency now defines performance
Wireless growth once relied on acquiring more spectrum. Regulatory and propagation limits now make that unsustainable.
Spectral efficiency has shifted from academic KPI to commercial necessity.
AI-driven software can optimize the link, but it cannot transmit the signal.
Built for physical AI systems
Physical AI systems such as autonomous vehicles, robotics fleets, drones, and distributed sensors rely on constant, high-capacity signal exchange. At scale, latency, dropped packets, and signal variability become coordination failures.
Ultra-Clean Signal™ technology reduces signal noise and energy waste inherent in legacy architectures, enabling:
- More consistent capacity across the cell
- Stable performance toward the cell edge
- Seamless handover between cells
- Scalable distributed MIMO coordination
Distributed MIMO Panel:
From theory to commercial reality
On March 3rd at 9:30 – 10am CET, Booth 2C70 (Rakuten Booth), Eridan representatives will participate in a Distributed MIMO panel session alongside leaders from NVIDIA, Rakuten Symphony, NTIA, and Northeastern University.
The discussion will focus on operational realities and commercialization path for distributed MIMO architectures.
Attend the session or schedule a follow-up discussion at Booth 5K26.
Media Contact:
Rick Timmons
Vice President of Sales and Marketing
rtimmons@eridan.io
